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Tosoh USA, Inc.
(CA Sales Office)
6000 Shoreline Court Ste 101
South San Francisco CA 94080
USA
Tell: Toll Free 1-888-799-0025
Fax: 1-650-210-4362
E-mail: info.tsgm@tosoh.com

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Fused Silica Glass

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Optical Fused Silica

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Terms and Conditions of Sale

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Fused Silica Glass (Fused Quartz)


Material:	N Series
Description:	Tosoh N and NP materials are manufactured by fusing a high-purity silica powder using Tosoh's proprietary oxy-hydrogen flame fusion process. Thanks to its high purity, low aluminum content, and extremely low level of bubbles and inclusions, N has become the reference material for a broad range of applications: semiconductor manufacturing, metrology, optics, chemical processing, UV and high-temperature windows to name a few. In particular, N is an enabling material for stringent plasma etch processes used in leading-edge semiconductor manufacturing. NP is an enhanced version of N material, with further reduced alkali content for use in processes that require extreme contamination control. Available in up to 1,200mm square ingots, N and NP materials are 450mm wafer ready.


Grades	Features
N	Semiconductor standard grade
NP	Semiconductor high-purity grade


Material:	OP Series
Description:	Tosoh OP-1 and OP-3 materials are manufactured by fusing high-purity silica powder using Tosoh's proprietary oxy-hydrogen flame fusion process and a method of generating uniformly dispersed small bubbles inside the material. Thanks to its high purity and excellent infrared blocking properties, OP-1 has become the material of choice as a heat-insulating material for semiconductor and solar manufacturing equipment, such as RTP chambers and oxidation, diffusion, and CVD batch furnaces. OP-3 is an enhanced version of OP-1 material, with further reduced alkali content for use in processes that require extreme contamination control. OP-3HD is a high-density version of OP-3, with a smaller diameter bubble size distribution that provides enhanced sealing properties and lifetime for advanced batch furnace processes. Available in up to 1,000mm round and square ingots, OP-1, OP-3, and OP-3HD materials are 450mm wafer ready.


Grades	Features
OP-1	Semiconductor standard grade
OP-3	Semiconductor high-purity grade
OP-3HD	High-density OP-3 grade


Material:	S Grade
Description:	Tosoh S material is manufactured by fusing a synthetic super high-purity silica powder using Tosoh's proprietary oxy-hydrogen flame process. Thank to its extreme purity and complete lack of inclusions, S material is the next generation of material for semiconductor manufacturing. Available in up to 1,200mm square ingots, S material is 450mm wafer ready.


Files are in PDF format (requires Adobe Reader to view):
Brochure »
SDS »
RoHS »
ISO Certificate »

Optical Fused Silica


Material:	ES Series
Description:	ES ingots are manufactured from high-purity SiCl₄ using an oxy-hydrogen flame in a verneuil type process. For very large parts, such as LCD photomasks, ES ingots are reflown into large rectangular blocks. ES ingots have a typical purity that exceeds the detection limit of 10ppb in all elements, and are virtually free of bubbles and inclusions. As a result, ES is the material of choice for LCD photomasks up to Gen. 10, and selected subgrades are widely used in leading edge stepper (KrF and ArF) and optics applications.


Material:	ED-H
Description:	ED-H ingots are manufactured from high-purity SiCl₄ in a VAD process. ED-H ingots have a typical purity that exceeds the detection limit of 10ppb in all elements, and are virtually free of bubbles and inclusions. Thanks to an OH content less than 100ppm, ED-H material exhibits superior transmission characteristics in the deep UV and is a material of choice for VUV applications down to 170nm.


Files are in PDF format (requires Adobe Reader to view):
Brochure »
SDS »
RoHS »
ISO Certificate »

Silica Glass - Quartz

Fused Silica Glass (Fused Quartz)

Optical Fused Silica